課程資訊
課程名稱
 高科技廠房設施設計
High-tech Facility Design 
開課學期
 105-1 
授課對象
 工學院  電腦輔助工程組  
授課教師
 莊子壽 
課號
 CIE5065 
課程識別碼
 521 U3790 
班次
  
學分
 3 
全/半年
 半年 
必/選修
 選修 
上課時間
 星期四7,8,9(14:20~17:20) 
上課地點
 土研405 
備註
 限學士班三年級以上。限本系所學生(含輔系、雙修生)。
限本系所學生(含輔系、雙修生) 且 限學士班三年級以上
總人數上限：30人 
Ceiba 課程網頁
 http://ceiba.ntu.edu.tw/1051CIE5065 
課程簡介影片
 
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課程概述

Purpose: The purpose of this course is to provide basic design knowledge needed for fabrication facilities that supplement high-tech manufacturing and R&D. High-Tech includes, not limited to, the advanced technologies applied in the fields of micro-electronics, optoelectronics, precision equipment, telecommunication, nanotech, pharmaceutics, biotech, medical devices, animal experiment, and Aerospace. The processes undertaken in high-tech manufacturing plants and R&D labs require cleanrooms with extremely stringent environmental control.

The environmental control includes temperature and humidity level, air/water quality, purity of chemicals and gases, noise and vibration degree, electromagnetic and radio frequency interference, electrostatic discharge, materials out-gassing, safe grounding, assurance of personnel health, safety and security and prevention of biohazard.

The focus of this course is on designing cleanroom and engineering its associated facilities. Students will gain skills needed to meet ever-changing challenge of delivering an ultra pure clean room and ultra pure utilities. Moreover, this course will strengthen students’ understanding and background in constructing high-tech manufacturing fab/plant and research lab. Many advanced topics will be introduced, such as 450mm/18" fab, 10 nm manufacturing, IoT (Internet of Things), Green Fab, FinFET (Fin Field-Effect Transistor), LiFi (Light Fidelity), Intelligent Sensing, AMHS (Automated Material Handling System)...etc.

Outstanding full-time students will be recommended for summer internship from high-tech companies and get exposure to high-tech facility design and/or construction in summer.

Scope: This course is intended to offer to undergraduate Juniors and Seniors, MS, EMBA & PhD students. Students in engineering, science, pharmacy, and life sciense will be exposed to fundamental theories and their applications in the design/build/certify of the high tech manufacturing plants and research labs. Academic faculty will teach basic theories and principles. Professional industrial experts will be invited to address the application of theories and principles in the real world practices. The contents will include lectures, pop quizzes, home works, a semester team project with an oral presentation and a written report, and/or a final examination. Field trips to visit high-tech plants and research labs, and cleanrooms will be arranged. Moreover, laboratory experiments will be provided to enable students to have hands-on experiences to measure the cleanroom where is the heart of high-tech M&R&D. 

課程目標
 The course will enable the students to:
1. Differentiate the typical processes in semiconductor, biotech, medical devices, and pharmaceutical manufacturing and R&D.
2. Explain the interdisciplinary nature of high tech manufacturing and research
3. Perform architectural design for cleanroom and schematically layout factory.
4. Use the basic theories and principles to design systems for heating, ventilation and air conditioning (HVAC,) water/air treatment, noise and vibration mitigation.
5. Classify cleanrooms in terms of various international standards.
6. Specify the environmental control criteria for cleanroom in terms of temperature and humidity level, air/water quality, purity of chemicals and gases, noise and vibration degree, electromagnetic and radio frequency interference, electrostatic discharge, materials outgassing, and safe grounding.
7. Apply the knowledge in testing and commissioning cleanroom and its associated facilities.
8. Establish contamination control programs for constructing, operating, and maintaining the high-tech facilities.
9. Address the issues in automatically managing the emergency, safety, and security systems.
10. Link to the information sources for further studies in nano/micro fabrication and research. 
課程要求
 Course Requirements:
There will be about 5~8 homeworks in fall 2016. Homework counts 20% of “Total Grade.” Students will be given reading assignments. The homework is to answer the questions derived from the reading assignments, lectures and lab experiments. One homework will be a group experiment to measure various attributes of cleanroom in room#408. (5%.) There is one (1) group term project. The group term project tests the student understands of the principal concepts covered in the course within the context of a comprehensive “real-world” problem. It also provides an opportunity to develop skills for working in a project team context and communication skills. The group term project counts 50% of the final grade. Out-of-town students are encouraged to form a group working on job-related topics through internet and/or other means.
Homework & Attendance:
Expect to be assigned homework problems each class session. Homework is due at the beginning of the next class session. No homework assignment can be missed without penalty, without an acceptable prior excuse. Homework counts 15% of ‘FINAL’ grade. In order to receive course credit and full grade, a student must:
.Satisfactorily complete ALL assignments.
Two unexcused absences will result in a grade of 'Incomplete' or 'Flunk', depending on whether or not the student is considered to be passing in all other aspects at the time of the third absence. Failure to complete ALL assignments will result in a grade of 'I' or 'F', depending on whether or not the student is considered to be passing in all other aspects.
Except in emergency situation, a student must attend all the field trip. Unexcused absences will result in a final grade of 'Incomplete.'
Meanwhile, each student will be individually required to take a lecture note on a selected class lecture or a field trip report, either illustrated in Chinese or English. Then, prepare a maximum 5-page report (5%.) The page limitation imposes an organizational and summarization burden on the student who takes the lecture note and field trip report. The writing must be concise and turn in two weeks after the lecture or field trip. Although figures, tables and graphs often help present useful concepts in less space, the illustrative demonstration of understating on the lecture or field trip will be weighted heavily. Simply download from the provided slides and/or class handouts is not acceptable.
The lecture note or field trip report should conform to good engineering practices and should include, as a minimum, a title page, abstract, table of contents, introduction, theories behind the lecture, conclusion, and references. The report should be in the student’s own words, any citation should be clearly noted and/or referred.

A Final Exam is required in the week of January 12, 2017. The Final Exam will be comprehensive and counted as 15% of “Total Grade.” Another 10% is for class participation.  
預期每週課後學習時數
  
Office Hours
  
指定閱讀
 1. Geng, Hwaiyu, Semiconductor Manufacturing Handbook, McGraw-Hill, New York, 2005.
2. Whyte, W., Cleanroom Design, John Wiley, 2nd ed., New York 1999
3. Van Zant, Peter, Microchip Fabrication, 5th ed., McGraw-Hill, New York, 2004.
Student hand-outs would be distributed periodically the above textbooks can be accessed and downloaded from NTU library system. 
參考書目
 1. Chang, C.Y., and Sze, S.M., ULSI Technology, McGraw-Hill Company, Inc., International Edition, 1996, New York.
2. Food and Drug Administration, Guideline on Sterile Drug Products Produced by Aseptic Processing, FDA, Information Branch, Rockville, Maryland, USA.
3. International Organization for Standards, ISO Standard 14644-4, part 4: Design, Construction, Start up, Geneva, Switzerland, 1999.
4. International Society of Pharmaceutical Engineering, Pharmaceutical Engineering Guide – A Guide for New Facilities, Volume 3: Sterile Manufacturing Facilities, ISPE, 2000.
5. Lurgi, S., Xu, J., and Zaslavsky, A., Future Trends in Microelectronics, Wiley, N.Y, 1999.
6. Mulhall, D., Our Molecular Future: How Nanotechnology, Robotics, Genetics, and Artificial Intelligence Will Transform Our World, Prometheus Books, Amherst, N.Y., 2002.
7. Nishi, Y., Doering, K., and Wooldridge, T., Handbook of Semiconductor Manufacturing Technology, Marcel Dekker, New York, 2000.
8. Scherge, M., Biological Micro- and Nanotribiology: Nature’s Solutions, Sprinker, New York, 2001.
9. 半導體製造技術，Quirk Serda 著，羅文雄、蔡榮輝 譯 ，滄海（2003）
10. 半導體奈米技術，龍文安 著，五南(2006)
11. 半導體英語，傳田精一 著，陳連春 譯，建興(2003)
12. 高科技廠務，顏登通，全華科技(2008)

 
評量方式
(僅供參考)
    
課程進度
週次
日期
單元主題
第1週
 09/15  Moon Festival (holiday) 
第2週
 09/22  Course Introduction,
High-tech Facilities Overview (Green Manufacturing and Fab Economics) 
第3週
 09/29  Fundamentals of Integrated Circuit Manufacturing Processes, (3D IC Design, Immersion, EUV, ArF-dry, Imprint, and Double Patterning) 
第4週
 10/06  Airborne Molecular Contamination and EMI Mitigation 
第5週
 10/13  5D Design Tool (BIM) and Term Project Kickoff 
第6週
 10/20  Plan, Design and Construction of a Fab
Environmental Impact Assessment 
第7週
 10/27  Fundamentals of Vibration,
Architecture and Structure Design 
第8週
 11/03  Fab Layout and Automated Material Handling System 
第9週
 11/10  No Midterm Exam, Mandatory Field Trip on 12/10.
Visit TSMC Construction Sites in Taichung  
第10週
 11/17  30% Design Review 
第11週
 11/24  UPW, Gases and Chemical System Design  
第12週
 12/01  Cleanroom and Mechanical System 
第13週
 12/08  Electrical and Facility Management & Control System
No Midterm Exam, Mandatory Field Trip on 12/10.
Visit TSMC Construction Sites in Taichung  
第14週
 12/15  60% Design Review Meeting and Concurrent Engineering 
第15週
 12/22  Code Compliance for Semiconductor Facilities 
第16週
 12/29  Air abatement, Wastewater treatment and Waste Management  
第17週
 01/05  Group Term Project Presentation (Final 100% Design Review)